· Candidate must possess at least a Bachelor's/College Degree in BS ECE / BS EE or any engineering course
QUALIFICATIONS & EXPERIENCE
· Applicant with experience in assembly or final test operations in engineering or maintenance activities for discrete and/or power packages products has an advantage.
· 1 - 2 years of experience in assembly packaging or electronics assembly industry. Knowledge in several of the following: standard packages (Plastic, Ceramic, Metal Cans), Multichip packaging, Module assembly, SMT, COB, Die Sales, Flip Chip
· Working knowledge of statistical tool such as Statistical Process Control (SPC), Design of Experiment (DOE), Process Failure Mode and Effect Analysis, Machine and Process Capability Study (M/PCpS), good problem solving skills and other continuous improvement programs.